Advanced packaging manufacturer in China, with soaring performance
In recent years, with the continuous development of semiconductor technology and the increasing demand for applications, advanced packaging has become an important field to promote the upgrading of the domestic semiconductor industry. Especially with the application of innovative technologies such as 2.5D/3D packaging, Chiplet technology, and System in Package (SiP), China's advanced packaging industry is ushering in new development opportunities and gradually becoming an important part of the global semiconductor industry.
2025-07-09
